BGA stencils

BGA solder set

Description: BGA solder set


Weight: 0.38 kg

BGA stencil 108 in 1

Description: BGA stencil 108 in 1


Weight: 0.02 kg

BGA stencil 110 in 1

Description: BGA stencil 110 in 1


Weight: 0.02 kg

BGA stencil 148 in 1

Description: BGA stencil 148 in 1


Weight: 0.02 kg

BGA stencil 4 in 1

Description: BGA stencil 4 in 1


Weight: 0.02 kg

BGA stencil 6320 flash

Description: BGA stencil 6320 flash


Weight: 0.01 kg

BGA stencil A

Description: CPU 188,T191/998,3310/3210/8850/2400/8210,C55,T28/T29,GD55, N188/N288,3688,AP-A102,LU-PS966,N100,9110,C6688/C3508,MSM3100 CDMA,702A , UEM T191/998,L2000,8310,E708 , FLASH 3208C3B,V70 L2000,808,N8,2688 V66,C55,GD55,7688 , DSP 6188 , MF 998,7650,T2688 IC 3310/3210/8210 ,V208, MC P20 , LU-PS966 , BF RFGC ,VTECH, C3508 V66 , 928/998, T18/T28 ,V70 8310/3310


Weight: 0.02 kg

BGA stencil A+B+C, 3 pcs in 1 set

Description: BGA stencil A+B+C, 3 pcs of defferent BGA stencil in 1 set


Weight: 0.01 kg

BGA stencil A760

Description: BGA stencil A760


Weight: 0.005 kg

BGA stencil B

Description: GD90,6230,6188,T39,S308,7650,928,NEC2100,881,V66/V60,A760 CPU 3210/8810/8210 IC , CDMA , S308, N8, EPSON, NEC68821, CDMAX350 , A68,A7690,6230,A620 UEM , A68,GD90, 8210/A100,7210/7250/6138/6100,T39/8310,T618,9110,GD92 FLASH , A68 DSP ,A68 MIDI,6230MF


Weight: 0.02 kg

BGA stencil C55 CPU

Description: BGA stencil C55 CPU


Weight: 0.01 kg

BGA stencil C62 (CPU)

Description: BGA stencil C62 (CPU)


Weight: 0.005 kg

BGA stencil CPU+Flash C55

Description: BGA stencil CPU+Flash C55


Weight: 0.02 kg

BGA stencil CPU+Flash C65

Description: BGA stencil CPU+Flash C65


Weight: 0.02 kg

BGA stencil E700

Description: BGA stencil E700


Weight: 0.005 kg

BGA stencil for C65, CPU

Description: BGA stencil for C65, CPU


Weight: 0.01 kg

BGA stencil K700

Description: BGA stencil K700


Weight: 0.02 kg

BGA stencil K750/K790/K810 CPU+UEM+Flash

Description: BGA stencil K750/K790/K810 CPU+UEM+Flash


Weight: 0.02 kg

BGA stencil MF 3220

Description: BGA stencil MF 3220


Weight: 0.02 kg

BGA stencil Motorola 23 in 1

Description: BGA stencil Motorola 23 in 1


Weight: 0.02 kg

BGA stencil new C

Description: BGA stencil new C


Weight: 0.02 kg

BGA stencil Nokia 34 in 1

Description: BGA stencil Nokia 34 in 1


Weight: 0.02 kg

BGA stencil P800

Description: BGA stencil P800


Weight: 0.02 kg

BGA stencil S300

Description: BGA stencil S300


Weight: 0.005 kg

BGA stencil S300 flash

Description: BGA stencil S300 flash


Weight: 0.005 kg

BGA stencil Samsung 18 in 1

Description: BGA stencil Siemens 18 in 1


Weight: 0.02 kg

BGA stencil Samsung D500 CPU

Description: BGA stencil Samsung D500 CPU


Weight: 0.02 kg

BGA stencil Samsung D500 Flash

Description: BGA stencil Samsung D500 Flash


Weight: 0.02 kg

BGA stencil Samsung D500 UEM

Description: BGA stencil Samsung D500 UEM


Weight: 0.02 kg

BGA stencil Samsung E630 CPU

Description: BGA stencil Samsung E630 CPU


Weight: 0.02 kg

BGA stencil Samsung E800 CPU

Description: BGA stencil Samsung E800 CPU


Weight: 0.02 kg

BGA stencil Sony Ericsson

Description: BGA stencil Sony Ericsson


Weight: 0.005 kg

BGA stencil Sony Ericsson 16 in 1

Description: BGA stencil Sony Ericsson 16 in 1


Weight: 0.02 kg

BGA stencil Sony Ericsson 20 in 1

Description: BGA stencil Sony Ericson 20 in 1


Weight: 0.02 kg

BGA stencil Sony Ericsson 9 in 1

Description: BGA stencil Sony Ericsson 9 in 1


Weight: 0.02 kg

BGA stencil T618

Description: BGA stencil T618


Weight: 0.005 kg

BGA stencil UEM 3220

Description: BGA stencil UEM 3220


Weight: 0.02 kg

BGA stencil UEM 6230

Description: BGA stencil UEM 6230


Weight: 0.02 kg

BGA stencil UEM V600

Description: BGA stencil UEM V600


Weight: 0.02 kg

BGA stencil V3/V3i/V3x

Description: BGA stencil V3/V3i/V3x


Weight: 0.02 kg

BGA stencil V300

Description: BGA stencil V300


Weight: 0.005 kg

BGA stencil X600 UEM

Description: BGA stencil X600 UEM


Weight: 0.02 kg

BGA stensil UEM 6630

Description: BGA stensil UEM 6630


Weight: 0.01 kg

BOKAR XURB-Set-S universal reballing unit

Description: Bokar XURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.


Input voltage: 220 V
Weight: 1.5 kg

Rubber for BGA

Description: Rubber for BGA


Weight: 0.002 kg

Universal BGA stencil (pitch 0,5)

Description: Universal BGA stencil (pitch 0,5)


Weight: 0.01 kg