BGA Paste Mechanic XG-50, (Sn 63%, Pb 37%, 35 g)

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BGA Paste Mechanic XG-50, (Sn 63%, Pb 37%, 35 g)
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USD 3.25
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ID: 820278 0.03 kg
Availability in stock:HKEUCN
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JYD-50 BGA ICs Soldering Paste is paste for soldering BGA ICs (50 g).

JYD-50 BGA ICs Soldering Paste Technical Specifications

Composition Sn 63%, Pb 37%
Weight 50 g


Tin Content
  • Sn 63%
Lead Content
  • Pb 37%
  • 35 g





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