BGA Rework System Quick EA-H15

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BGA Rework System Quick EA-H15
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USD 13800.00
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ID: 869160 144 kg 220 V
Availability in stock:HKEUCNUA
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Warranty: 12 month (s)
 

Overview

Quick EA-H15 – repair system with the increased power for soldering and desoldering various components.

The system is an upgraded version of QUICK BGA2015 station and consists of the QUICK IR EA-H15 infrared rework station, QUICK PL EA-H15 precise laser mounting system, QUICK RPC EA-H15 visualization camera.

Features

  • Perfect for soldering and reworking of CBGA, CCGA, CSP, QFN, MLF, PGA and others.
  • Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution.
  • PL Precise aligning and placing system: visible double-colors optical lens alignment, overlap alignment between solder ball and soldering pad is scientific and accurate; easy control, and pick-up and placement.
  • The whole process can be recorded, controlled and analyzed and then generate curve diagram by connecting to PC using IRsoft Software.
  • Programmable soldering control system, 10 modes storage memory, password protection
  • Bottom heater large size prevents the PCB from irregular heating and damage
  • Microprocessor control and low-inertial heaters ensure the maximum thermal stability
  • Laser LED pointer to highlight the operation area center
  • Built-in vacuum pump for component pick-up (max 0.05 MPa)
  • Upper LED light: blue color, adjustable brightness
  • Lower LED light: yellow color, adjustable brightness
  • Multi-purpose holder frame with flexible fixation for tiny and complex-shape PCBs included
  • Monitor (option)
  • Upper and bottom cooling fans included

Technical Specifications

General Power 2400 W (max.)
Top Heater Power 720 W (120 W×6, infrared heating tube, wavelength: 2~8 µm)
Bottom Heater Power 1600 W (400 W×4, infrared ceramic heater) – standard
2000 W (500 W×4, infrared ceramic heating tubes) – option
Top heater range size 20 ~ 60 mm (X, Y axes alignment)
Bottom Heater Size 260×260 mm
Max PCB Size 400×400 mm
Max SMD (BGA) Components Size 60×60 mm
Temperature Sensor Infrared, 0…300°C
Positioning Camera Magnification:: 220x (22x optical + 10x digital), Horizontal resolution: 480 TV lines, PAL format, power 12 V/300 mA
RPC Visualization Camera Magnification: 220x (22x optical + 10x digital), Horizontal resolution: 480 TV lines, PAL format
Dimensions (L×W×H) 850×720×730 mm
Weight ~ 75 kg

Video

User Manual

PDF  Download Quick EA-H15 Operation Manual.

Compatibility

  • Main Unit Quick BGA EA-H15 — 1 pc..
  • Control box
  • IR Camera RPC
  • Video line
  • USB connect line
  • Video capture card
  • BGA tool box
  • Operation Manual

Note! The monitor is not included in the package and may be ordered as an option.

Specifications

Total power
  • 2800 W
Upper heater power
  • 720 W
Upper heater type
  • ceramic
Bottom heater type
  • ceramic
Bottom heater size
  • 260 x 260 mm
Control type
  • microcontroller / PC synchronization

Tips

Warranty

Payment

Delivery

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