BGA Paste Mechanic XG50, (Sn 63%, Pb 37%, 183 °C, 35 g)
id: 820278
BGA ICs soldering paste (50 g), composition: Sn 63%, Pb 37%. Read more
JYD-50 BGA ICs Soldering Paste is paste for soldering BGA ICs (50 g).
JYD-50 BGA ICs Soldering Paste Technical Specifications
Composition | Sn 63%, Pb 37% |
Weight | 50 g |
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