RB-01 Reballing Stencil Tin Net Full Set for EMMC / EMCP / UFS
id: 907761
RB-01 Reballing Stencil Tin Net Full Set for EMMC / EMCP / UFS
Overview
Description
Specifications
Delivery
Payment
Warranty
USD 39.90
Add to cart
Overview
0.25 kg
Availability in stock:
HK EU
New platform for convenient and effective BGA reballing of EMMC / EMCP / UFS chips (BGA153 / BGA162 / BGA169 / BGA186 / BGA221 / BGA254). Fixed Plate and Magnetic Base Holder are included. Read more
Buy wholesale and save
Inform of price reduction
Suggest your price
Description
How it works (video)
Advantages
- High precision and precise alignment. Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.
- Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape.
- Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid, and anti-scald so that the tin planting position is more stable.
- Double magnet ensures accurate positioning without shaking.
Features
- Support for EMMC / EMCP / UFS:
- BGA153, BGA162, BGA169, BGA186, BGA221, BGA254
Specifications
- Fixing plate and holder included.
- Stencil net thickness: 0.15 mm
- Support IC size: 11.5 x 13 mm, 12 x 16 mm
- Holder size: 80 x 80 x 15 mm
- Packing size: 89 x 89 x 32 mm
Package Content
- Stencils - 6 pcs.
- Adjustment frame - 2 pcs.
- Adjustment piece - 2 pcs.
- Tin scraper - 1 pc.
- Fixed plate - 1 pc.
- Holder - 1 pc.
Product specifications, appearance and package content may differ from those presented on the website and can be changed without notice. Please, contact sales manager before purchase.
All rights reserved. This material from gsmserver.com web site may not be published, rewritten or redistributed in whole or part without authorship indicated and backlinks provided.
Specifications
| Adapters is compatible with the following models of Cell phones |
|
Delivery
Payment
Warranty
