Solder Goot SF-A0408
id: 900497
A 0.8 mm diameter lead-free solder which contains 96.5% tin, 3% silver, and 0.5% copper. Melting point: 217˚C-220˚C. Read more
Buy wholesale and save
Inform of price reduction
Goot SF-A0408 is a 0.8 mm diameter lead-free solder which contains 96.5% tin, 3% silver and 0.5% copper. The solder has high mechanical strength and electrical conductivity and may be used for all kinds of work.
Features
- It doesn't crack and prevents contact damage due to frequent heating and cooling.
- Lead-free solder has a higher melting point compared to a standard Sn/Pb solder.
Technical Specifications
Melting point | 217˚C-220˚C |
Diameter | 0.8 mm |
Composition | Sn 96.5%; Ag 3.0%; Cu 0.5% |
Coil diameter | 5 cm |
Weight | 45 g |
Package Contents
- Solder Goot SF-A0408 — 1 pc.
Product specifications, appearance and package content may differ from those presented on the website and can be changed without notice. Please, contact sales manager before purchase.
All rights reserved. This material from gsmserver.com web site may not be published, rewritten or redistributed in whole or part without authorship indicated and backlinks provided.
Diameter |
|
Tin Content |
|
Silver Content |
|
Copper Content |
|
Characteristics |
|
Weight |
|