Flux Paste RELIFE RL-223-OR, (for lead-free soldering, high-level, 100 g)
id: 885621
Flux Paste RELIFE RL-223-OR, (for lead-free soldering, high-level, 100 g)
Overview
Description
Specifications
Delivery
Payment
Warranty
USD 7.94
Add to cart
Overview
0.1 kg
Availability in stock:
HK
Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue. Read more
Buy wholesale and save
Inform of price reduction
Suggest your price
Description
RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
Features
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
Technical Specifications
| Net weight | 100 g |
| Package Dimensions | 65 × 75 × 60 mm |
Package Contents
- Solder Paste RELIFE RL-223-OR (100 g) — 1 pc.
Product specifications, appearance and package content may differ from those presented on the website and can be changed without notice. Please, contact sales manager before purchase.
All rights reserved. This material from gsmserver.com web site may not be published, rewritten or redistributed in whole or part without authorship indicated and backlinks provided.
Specifications
| Characteristics |
|
| Weight |
|
| Intended Purpose |
|
Delivery
Payment
Warranty
