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Flux Pastes
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ID: 885621
Flux Paste RELIFE RL-223-OR, (for lead-free soldering, high-level, 100 g)
USD 7.94
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Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue.
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HK
ID: 885621 0.1 kg
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ID: 885615
Soldering Paste RELIFE RL-420-UV (18 g)
USD 1.36
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Light yellow solder paste for soldering and reballing BGA and PGA components on phone mainboards. No rinsing.
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HK
ID: 885615 0.1 kg
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ID: 885616
Flux Paste RELIFE RL-421S-OR, (for lead-free soldering, active, 10 ml)
USD 2.14
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High viscosity lead free solder paste designed for soldering and reballing SMD components and PCB. No residue.
Availability in stock:
HK
ID: 885616 0.05 kg
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ID: 885617
Flux Paste RELIFE RL-422S-IM, (for lead-free soldering, high-level, 10 ml)
USD 2.34
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Strong active insulating flux paste for repairing mobile phones motherboards, CPU, etc. Lead-free and halogen-free. High insulation resistance.
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HK
ID: 885617 0.05 kg
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ID: 885618
Flux Paste RELIFE RL-UV424-OR (10 ml)
USD 3.14
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Gel-like acid-free flux paste without impurities. Used for electronic components soldering and reballing. Features strong activity and high insulation resistance.
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HK
ID: 885618 0.05 kg
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ID: 885619
Soldering Paste RELIFE RL-428-OR (100 g)
USD 10.67
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Highly active halogen-free viscous soldering paste. Due to high insulation resistance, it can be used for PCB soldering and reballing.
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HK
ID: 885619 0.1 kg
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ID: 885620
Flux Paste RELIFE RL-559-IM, (for lead-free soldering, 100 g)
USD 10.67
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Milky white soldering paste, not containing lead and halogens. Features high insulation resistance. It provides quick and high-quality tinning.
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HK
ID: 885620 0.1 kg
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ID: 901327
Flux Paste RELIFE RL-UV425-OR , (for soldering copper and steel, for lead-free soldering, universal, 50 g)
USD 5.00
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Gel-like acid-free flux paste without impurities. Used for electronic components soldering and reballing. Features strong activity and high insulation resistance.
ID: 901327 0.1 kg
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ID: 4847
Soldering Paste Pro'sKit 8S005 (50 g)
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Not suitable for SMD and BGA soldering. Prevents from defects emergence. The paste has a good diffusion and non-corrosion properties.
ID: 4847 0.05 kg
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ID: 906082
Soldering Paste Jakemy JM-SW03 (50 g)
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Neutral (pH 7±0.3) non-toxic soldering paste for copper and steel. Weight: 50 g.
ID: 906082 0.1 kg
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ID: 917077
Flux Paste Mechanic UV223, (100 g)
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ID: 917077 0.11 kg