Phone Servicing Solutions BGA EMMC / EMCP / UFS

New platform for convenient and effective BGA reballing of EMMC / EMCP / UFS chips (BGA153 / BGA162 / BGA169 / BGA186 / BGA221 / BGA254 / BGA297). Fixed Plate and Magnetic Base Holder are included.

This holder with stencil net set is intended for reballing of 99% ICs on the market such as A8-A17 for iPhone 6 up to 15 series, as well as Qualcomm Snapdragon, Hisilicon Kirin, MTK Dimensity, and Samsung Exynos series.