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Phone Servicing Solutions BGA EMMC / EMCP / UFS

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New platform for convenient and effective BGA reballing of EMMC / EMCP / UFS chips (BGA153 / BGA162 / BGA169 / BGA186 / BGA221 / BGA254). Fixed Plate and Magnetic Base Holder are included.
Availability in stock: HK EU
ID: 907761 0.25 kg
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